From Cost-Cutting Fears to ‘Premium Treatment’ for Exynos 2700
Early industry chatter suggested Samsung might strip advanced packaging from the Exynos 2700 chip to save costs on the Galaxy S27 lineup, a move that raised concerns about performance and thermal behavior. Those claims have now been challenged by a fresh report indicating the company instead plans to give its upcoming 2nm chipset the “best in-house technologies” available. This reversal is significant: packaging choices directly affect how efficiently a processor runs, especially under heavy loads. While the original report painted a picture of compromise amid component pressures, the latest rumor frames Samsung’s strategy as one of confidence and competitiveness. Rather than dialing back, the Exynos 2700 appears set to be positioned as a true flagship-class Galaxy S27 processor designed to stand toe to toe with rival premium mobile platforms.
FOWLP vs. Side‑by‑Side: Untangling the Packaging Rumors
The biggest point of confusion is whether the Exynos 2700 will keep Fan-Out Wafer-Level Packaging (FOWLP) or move to a different advanced packaging technology. One report claimed Samsung would abandon FOWLP, which has been used since the Exynos 2400, due to its complex and less profitable manufacturing process. Another, however, states that FOWLP will be maintained and that the earlier claims were based on misleading information. At the same time, Samsung is reportedly adopting a new Side-by-Side (SbS) architecture for the Exynos 2700, placing the application processor and DRAM next to each other on a substrate rather than stacking them. These accounts are not necessarily mutually exclusive; SbS could coexist with FOWLP, but until Samsung confirms the final design, the exact combination of advanced packaging technology on the 2nm chipset remains uncertain.
How Packaging and 2nm Process Shape Galaxy S27 Performance
Whatever final mix of FOWLP, SbS, and other methods Samsung chooses, packaging will be a key differentiator for the Exynos 2700 and, by extension, the Galaxy S27’s real-world behavior. FOWLP is credited with up to 40% smaller chip size, 30% lower thickness, and 16% better thermal resistance, factors that help sustain higher performance without overheating. The reported Side-by-Side layout, combined with Samsung’s Heat Pass Block technology, is meant to improve heat transfer between the CPU and DRAM and route it away more efficiently. Paired with a second-generation 2nm gate-all-around process, these choices should translate into better sustained frame rates, faster app responsiveness, and lower power consumption under demanding workloads. For consumers, the bottom line is a Galaxy S27 processor that can hold peak performance longer while using less energy and generating less heat.
Signals of Confidence in Exynos 2700’s Competitive Ambitions
Reports that Samsung will treat the Exynos 2700 with its “best packaging and technologies” suggest the company sees the chip as a central pillar of its flagship strategy, not a cost-cut compromise. Rather than retreating from expensive advanced packaging technology, Samsung appears inclined to invest in it to raise the competitive bar against alternative high-end platforms like Snapdragon and Dimensity. This approach supports a narrative that the Galaxy S27 and S27+ will rely heavily on in-house silicon to deliver differentiated performance, efficiency, and thermal behavior. If Samsung follows through and avoids last-minute downgrades in packaging during mass production, it would signal strong internal confidence in its 2nm process, design, and manufacturing capabilities. For the broader market, that would mark Exynos 2700 as a serious contender in the next generation of flagship mobile chipsets.