From Problematic Exynos to Ambitious Exynos 2700
Samsung’s in-house processors have travelled a long road. Earlier Exynos generations were criticized for overheating and lagging behind rival chips, but the Exynos 2400 used in the Galaxy S24 and S24+ marked a visible reset, with better thermal behavior and more competitive performance. The next step is the Exynos 2700 chip, widely expected to act as the Galaxy S27 processor in select markets. Rumors point to a 10‑core CPU built on Samsung Foundry’s second‑generation 2nm process, paired with an AMD RDNA 5‑based Xclipse 970 GPU, plus support for LPDDR6 RAM and UFS 5.0 storage. On paper, that combination positions Exynos 2700 as a true Samsung flagship performance play. Yet, around this otherwise premium specification sheet, a heated debate is emerging over smartphone chip packaging choices and whether cost‑cutting decisions will undermine the capabilities of Samsung’s most ambitious silicon.
FOWLP vs. SbS and HPB: The Packaging Crossroads
At the center of the controversy is Fan‑Out Wafer‑Level Packaging (FOWLP), an advanced form of smartphone chip packaging first used by Samsung on the Exynos 2400. FOWLP relocates electrical connections outside the die area, enabling smaller and thinner chips with improved thermal resistance and performance under sustained loads. However, it is complex and costly to manufacture and can reduce yields, cutting into profitability. Multiple reports now claim Samsung is considering dropping FOWLP for the Exynos 2700, moving instead to a Side‑by‑Side (SbS) architecture that places the application processor and DRAM next to each other on a single substrate. In tandem, Samsung’s Heat Path Block (HPB) technology, previously used in a package‑on‑package layout, would be adapted to this SbS design to channel heat away from both processor and memory, potentially offsetting some of the benefits lost if FOWLP is abandoned.
Conflicting Rumors: Premium Treatment or Quiet Cost Cuts?
The narrative around Exynos 2700 packaging is now sharply split. One line of reporting, citing industry sources, says Samsung will ditch FOWLP in favor of SbS to improve margins, even if that sacrifices some of the gains in thermal performance seen with Exynos 2400. Another, via a well‑known leaker, insists the opposite: that Samsung plans to give its 2nm Exynos 2700 the “best” in‑house technologies, explicitly including FOWLP, to better compete with Qualcomm’s Snapdragon 8 Elite Gen 6 Pro and MediaTek’s Dimensity 9600 Pro. This camp argues that earlier claims about removing FOWLP may have stemmed from reports with ulterior motives amid internal labor disputes. Yet even this more optimistic view concedes one risk: because FOWLP is expensive, Samsung could still opt for a last‑minute packaging downgrade when the Exynos 2700 enters mass production, turning the current reassurance into a temporary reprieve rather than a firm guarantee.
What Packaging Choices Mean for Galaxy S27 Performance
For buyers, the packaging debate is not academic. FOWLP’s advertised benefits—up to 40% smaller area, 30% lower thickness and 16% better thermal resistance—translate into more compact boards, slimmer phones, and more stable performance during prolonged gaming or camera use. A Galaxy S27 processor using Exynos 2700 with FOWLP and the new SbS plus HPB heat‑dissipation scheme could offer strong sustained speeds and improved Samsung flagship performance, reinforcing confidence in the Exynos comeback story. If FOWLP is removed, SbS and HPB may still keep temperatures in check, but there is a higher risk of earlier throttling and less headroom for future software features. That trade‑off will be especially noticeable if competing Snapdragon and Dimensity chips maintain cutting‑edge packaging, widening the perception gap between Samsung’s in‑house silicon and third‑party alternatives inside otherwise similar flagship devices.
Cost Optimisation, Snapdragon Pricing and Consumer Value
Behind these technical decisions is a straightforward business challenge: balancing component cost and perceived value in a maturing flagship market. Reports suggest Samsung is exploring various cost‑reduction levers for the Galaxy S27 line, from potentially cheaper OLED suppliers on the base model to reconsidering the expensive FOWLP route for its 2nm Exynos 2700 chip. These choices matter more if the Snapdragon 8 Elite Gen 6 Pro, expected to power certain Galaxy S27 Ultra variants, becomes pricier, squeezing margins on models that rely on Qualcomm silicon. If Samsung keeps FOWLP on Exynos 2700, it may absorb higher silicon costs to defend performance leadership and brand prestige. If it drops FOWLP, it could protect profitability and moderate retail pricing but risk re‑igniting doubts about Exynos‑based Galaxy S27 units. The final packaging choice will therefore help determine not just benchmarks, but how fair and future‑proof the overall value proposition feels to flagship buyers.